Tšebeliso ea LTCC Technology in Wireless Communications

1.High-Frequency Component Kopanyo

Theknoloji ea LTCC e thusa ho kopanya likarolo tse ngata tse sa sebetseng tse sebetsang libakeng tse phahameng tsa maqhubu (10 MHz ho ea ho lihlopha tsa terahertz) ka meaho ea multilayer ceramic le mekhoa ea khatiso ea li-conductor tsa silevera, ho kenyelletsa:

2.Lisefe:Li-filters tsa Novel LTCC tsa multilayer bandpass, tse sebelisang moralo oa lumped-parameter le ho thunngoa ha mocheso o tlase (800-900 ° C), li bohlokoa bakeng sa liteishene tsa 5G le li-smartphones, ka katleho li hatella tšitiso ea kantle ho sehlopha le ho matlafatsa bohloeki ba matšoao. Li-filters tse kopantsoeng ka mahlakoreng a millimeter-wave li ntlafatsa ho lahloa ha li-stopband le ho fokotsa boholo ba potoloho ka li-cross-coupling le meaho e kentsoeng ea 3D, ho fihlela litlhoko tsa puisano tsa radar le sathelaete.

3.Antennas & Power dividers:Lisebelisoa tse tlase tsa dielectric (ε _r = 5-10) tse kopantsoeng le khatiso e nepahetseng ea silevera ea pente e tšehetsang ho etsoa ha li-antenna tse phahameng tsa Q, li-couplers le likarohano tsa matla, ho ntlafatsa ts'ebetso ea RF e ka pele.

Lisebelisoa tsa mantlha ho 5G Communications

1.5G Base Stations & Terminals:Lisefe tsa LTCC, tse nang le melemo ea boholo bo kopanetsoeng, bophara bo pharaletseng, le ts'epahalo e phahameng, li fetohile litharollo tse ka sehloohong bakeng sa 5G Sub-6GHz le li-millimeter-wave filters, ho nkela li-filters tsa khale tsa SAW/BAW sebaka.

2.RF Front-End Modules:Ho kopanngoa ha likaroloana tse sa sebetseng (lifilimi tsa LC, li-duplexers, baluns) tse nang le li-chips tse sebetsang (mohlala, li-amplifiers) ho li-module tsa compact SiP ho fokotsa tahlehelo ea matšoao le ho ntlafatsa ts'ebetso ea tsamaiso.

3.Melemo ea Technical Driving Innovation

Maqhubu a Phahameng le Ts'ebetso ea Thermal:Tahlehelo e tlase ea dielectric (tanδ <0.002) le conductivity e phahameng ea mocheso (2–3 W/m·K) e netefatsa phetisetso e tsitsitseng ea maqhubu a phahameng le taolo e ntlafalitsoeng ea mocheso bakeng sa lits'ebetso tsa matla a phahameng57.

Bokhoni ba ho Kopanya 3D:Li-substrates tsa Multilayer tse nang le likarolo tse kenyellelitsoeng tse sa sebetseng (li-capacitor, li-inductors) li fokotsa litlhoko tsa holimo, ho fihlela> 50% ea phokotso ea molumo oa potoloho.

Chengdu Concept Microwave Technology CO.,Ltd ke moetsi ea hloahloa oa lisebelisoa tsa 5G/6G RF naheng ea China, ho kenyeletsoa filthara ea RF lowpass, filthara ea highpass, filthara ea bandpass, sefahla sa notch/sefahla sa ho emisa band, duplexer, Power divider le directional coupler. Kaofela ha tsona li ka etsoa ho latela litlhoko tsa hau.

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